TCU

Swiss Franc 7'633.00

For precise temperature control when printing solder paste – for optimal print quality and process reliability.

Beschreibung

Temperature control unit for solder paste printing
Ideally suited for: Solder paste printing

The TCU was specially designed for the Application in solder paste printing developed. Through the use of heating and cooling elements does she ensure a constant temperature in the pressure range, to to optimize the performance and processability of the solder paste.

Key features:
– Compact design
– Programmable temperature range
– condensate collection container

Manual (PDF)

Technical Data Sheet (PDF)